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Time： 2024-08-18  韦克威科技

Reliability and Failure Analysis of Electronic Components (II)

Manufacturing process and defects of electronic components

1. Defects and yield prediction in chip processing
Classification of chip manufacturing defects:

  • IC process:Oxidation, diffusion, coating, photolithography, etc

  • Thick film process:Substrate processing, plate making, screen printing, sintering, laser resistance adjustment, separation of component assembly, etc

  • Thin film process:Substrate processing, plate making, thin film preparation, photolithography, electroplating, etc

Reason for failure:
Component failure: 31%
Interconnection failure: 23%, wire bonding failure, poor chip bonding, etc
Staining failure: 21%
Regarding hybrid integrated circuits:
According to the manufacturing process, integrated circuits can be divided into:
(1) Semiconductor integrated circuit (substrate: semiconductor)
Namely: Single chip integrated circuit (solid-state circuit)
Process: Semiconductor process (diffusion, oxidation, epitaxy, etc.)
(2) Membrane integrated circuit (substrate: glass, ceramic, etc. insulator)
workmanship
Thin film integrated circuits - vacuum evaporation, sputtering, chemical vapor deposition technology
Thick film integrated circuits - coated with paste on a substrate and sintered (screen printing technology)
3. Hybrid Integrated Circuit
Characteristics: Fully utilize the advantages of semiconductor integrated circuits and membrane integrated circuits to achieve complementary advantages;
Process: Passive components are made using film technology, and active devices are made using semiconductor ICs or transistors.
Comparison of three types of integrated circuits:
Vicorv High-Reliability Electronic Components


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